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View Unit : Processing Electronic Components within the Manufacturing System

Unit
Unit Reference Number
A/502/9242
Qualification Framework
QCF
Title
Processing Electronic Components within the Manufacturing System
Unit Level
Level 3
Unit Sub Level
None
Guided Learning Hours
126
Unit Credit Value
50
Date of Withdrawal
SSAs
4.1 Engineering
Unit Grading Structure
Pass
Assessment Guidance

This unit must be assessed in a work environment and must be assessed in accordance with the ‘Common Requirements for National Vocational Qualifications (NVQ) in the QCF’ which can be downloaded from Semta’s website: http://www.semta.org.uk/training_providers__awarding/national_occupational_standard/qca_assessment_requirements.aspx

 

Additional assessment requirements have been published by Semta. These additional assessment requirements are set down in Semta’s Engineering unit assessment strategy which can be downloaded from Semta’s website: http://www.semta.org.uk/training_providers__awarding/national_occupational_standard/qca_assessment_requirements.aspx

 

 

Learning Outcomes and Assessment Criteria
Learning Outcome - The learner will:Assessment Criterion - The learner can:
1

Process electronic components within the manufacturing system

1.1

Work safely at all times, complying with health and safety and other relevant regulations and guidelines

1.2

Ensure that the materials to be processed are suitably prepared for the processing operations to be carried out

1.3

Carry out all of the following during the processing of the electronic components:

  • obtain any necessary permission/work permits for the processing operations to be conducted
  • follow risk assessment procedures and COSHH regulations
  • follow clean work area protocols, where appropriate
  • carry out any preparations of materials and components, in line with organisational procedures
1.4

Use appropriate sources to access work related instructions, to include threeof the following:

  • assembly route cards
  • assembly/process stage instructions
  • CD-based multimedia packages
  • other electronic means
  • written instructions
  • diagrams/drawings
1.5

Obtain and interpret work instructions for electronic component processing operations, for one type of component from the following:

  • capacitors (such as ceramic disc, multi-layer ceramic, surface mount, trimmer disc, connector filtering )
  • resistors (such as oxide film, surface mount, wirewound)
  • inductors (various types including, surface mount)
  • interconnection devices (such as edge connectors, test points, insulated chassis connectors)
  • sensor devices (such as used for process control and environmental monitoring applications)
1.6

Continued:

  • optical devices (such as optical fibre, optical waveguides, optical backplanes, optical interconnection)
  • visual display tubes (such as used for PC screens)
  • switching components (such as klystrons, thyratrons)
  • microwave components (such as magnetrons, travelling wave tubes, other microwave components)
  • spark gaps (such as is used in electromagnetic pulse surge protection and high energy switching applications)
  • charge coupled devices (such as is used in image detection type applications)
1.7

Obtain and prepare materials, component parts and equipment for processing,to include carrying out all of the following:

  • receive or requisition kits of parts and/or materials for assembly/processing
  • obtain, prepare or modify standard parts as needed
  • prepare assembly jigs/aids
  • set out components for efficient working
  • prepare production equipment for assembly/process (such as set parameters, temperature profiles, times, speeds, pressures, vacuum, test settings)
  • obtain chemicals as required (such as solders/fluxes, plating solutions)
1.8

Check and monitor that the processing equipment is set up and maintained at satisfactory operating conditions throughout the processing operations

1.9

Carry out the process in accordance with operating procedures and the work piece specification requirements

1.10

Process electronic components, to include completing two of the following:

  • follow stage-by-stage instructions for the assembly/process recipe stages involved
  • hand assemble/join/interconnect parts
  • use automated assembly/processing equipment
  • plate on combinations of nickel/silver/gold to form component terminations
  • ink screens to prepare component layers, and cut, release and fire components (where appropriate)
  • apply coatings/glazes to seal/finish the components
  • tape and reel components into standardised cassette receptacles
  • pump vacuums to required specification, and seal the component
  • seal component housings
1.11

Carry out the processing of electronic components, to meet one of the following quality and accuracy standards:

  • company standard and procedures
  • BS or ISO standards and procedures
  • other international standard
  • customer standards and requirements
1.12

Monitor the components, during and on completion of the processes, and carry out two of the following:

  • conduct basic functional/dimensional/security checks, in line with procedures
  • sample check the work at each stage
  • conduct self-generated, ad-hoc inspection checks
  • apply quality improvement controls and techniques (such as statistical process control (SPC), failure mode effect analysis (FMEA))
  • check vacuum levels
1.13

Ensure that the processed workpiece achieves the required characteristics and meets the processing specification

1.14

Deal promptly and effectively with problems within their control and report those that they cannot solve

1.15

Dispose of waste and excess materials in line with agreed organisational procedures

1.16

Shut down the processing equipment to a safe condition on completion of the processing activities

1.17

Present reports of the processing activities, using the following method:

  • verbally

Plus one more method from the following:

  • electronic mail
  • computer-based presentation
  • written/typed report
2

Know how to process electronic components within the manufacturing system

2.1

Describe the specific safety precautions to be taken whilst carrying out the processing electronic components, including any specific legislation, regulations or codes of practice relating to the activities, equipment or materials

2.2

Describe the health and safety requirements of the work area in which they are carrying out the processing activities, and the responsibility these requirements place on them.

2.3

Describe the COSHH regulations with regard to the substances used in the process activities

2.4

Describe the hazards associated with processing electronic components, and how they can be minimised

2.5

Describe the personal protective equipment and clothing to be worn during the processing activities

2.6

Explain how to extract and use information from engineering drawings and related specifications (to include symbols and conventions to appropriate BS or ISO standards), in relation to work undertaken

2.7

Explain how to recognise and deal effectively with victims of electric shock (to include methods of safely removing the victim from the power source, isolating the power source, and methods of first aid resuscitation)

2.8

Explain how to interpret the company’s information for the appropriate manufacturing assembly/processing stage (such as diagrams, drawings and specifications, information from computer-based files)

2.9

Describe the relevant assembly/manufacturing processing techniques, their ordering and how they are applied

2.10

Explain how to recognise of defects/problems (such as manufacturing stages, components to be assembled/processed)

2.11

Describe the component types being processed/assembled, and the different values and ratings of the components used (such as resistance, capacitance, inductance values and tolerances, voltage and current ratings, insulation resistance)

2.12

Explain how to set up/programme and use the tooling and equipment involved in the relevant assembly/process stages being undertaken

2.13

Describe the quality control procedures to be followed during the processing operations

2.14

Explain how to conduct any necessary checks to ensure the accuracy, position, security, function and completeness of the processed component

2.15

Describe the defects and problems likely to be encountered in the various component manufacturing processes

2.16

Explain how to deal safely and effectively with any waste/surplus materials and chemicals from the processing

2.17

Describe the extent of their own responsibility, and to whom they should report if they have problems that they cannot resolve

Equivalent Units
There are no equivalences to display.
2.1.3.0L